項(xiàng)目名稱： 高密度柔性Mini-LED背光模組

High-Resolution Flexible Mini-LED Back-Lighting Module

申報(bào)單位： 深圳遠(yuǎn)芯光路科技有限公司

綜合介紹或申報(bào)理由：

本項(xiàng)目利用全球首創(chuàng)的“新型封裝材料+特制設(shè)備+捆綁工藝”的全套技術(shù)方案，可實(shí)現(xiàn)柔性基板上Mini-LED超高密度的巨量封裝（目前點(diǎn)間距可達(dá)到P0.3mm，極限可到P0.2mm左右，單片模組尺寸最大可至10英寸），且整個(gè)最終的背光模組更加輕?。?00微米以下）和可彎曲。該產(chǎn)品為業(yè)界唯一超高密度&超輕薄的柔性Mini-LED背光模組產(chǎn)品。

另外，本項(xiàng)目的技術(shù)壁壘高，在新型封裝材料、設(shè)備及工藝方面都具有自主知識(shí)產(chǎn)權(quán)，并完全形成閉環(huán)系統(tǒng)：可實(shí)現(xiàn)超低溫倒裝封裝技術(shù)，節(jié)省能耗；并采用新型的卷對(duì)卷及面陣式巨量封裝設(shè)備，提高生產(chǎn)效率；其可靠性與良品率能與成熟的LED封裝工藝媲美，并且達(dá)到傳統(tǒng)焊膏無(wú)法實(shí)現(xiàn)的超小點(diǎn)間距；可在線返修機(jī)AOI，并捆綁巨量轉(zhuǎn)移設(shè)備；可極大提高生產(chǎn)速度、降低成本，可真正實(shí)現(xiàn)低成本、及高分辨率的Mini-LED 柔性背光標(biāo)準(zhǔn)尺寸模組的規(guī)?；慨a(chǎn)，有望在全行業(yè)中得到推廣，推動(dòng)Mini-LED行業(yè)的快速發(fā)展。

In this project, the whole technical scheme is including new packaging materials, special designed facilities and the new bonding process, which is initiated by the world. It can be used to realize the ultra-high resolution Mini-LED back-lighting module on the flexible substrate. Its point spacing can reach P0.3mm at current mass-production capability, the limitation can go down to P0.2mm in future. And its the maximum size of single module can reach 10 inches. Moreover,the final backlight module is much lighter with higher flexibility than before because of the ultra-thin flexible substrate (<30 microns). This new product with such kind of excellent acteristic is the one and only in the market.
In addition, the technical barriers of this project are high. It has independent intellectual property rights in new packaging materials, equipment and technology, which forms a closed-loop system completely.It advantages are shown as below:
(1) It can realize ultra-low temperature flip-chip packaging to save energy consumption and be able to use such kind of low cost flexible material as the substrate;
(2)It can adopt the roll-to-roll production scheme to improve production efficiency; (3)
(3) Its packaging reliability and yield can be comparable with mature LED packaging technology, and the cost remain as before；
(4) It can reach the ultra-small point spacing which the traditional solder paste cant achieve, to realize the ultra-high resolution;
(5)Its final special designed facility can integrate the online repair system, the AOI system, and the mass-transfer system in one production line, which can make mass packaging come true.
To conclude, this technology can greatly improve the production speed, reduce the cost, and truly realize the high-resolution Mini-LED flexible back-light module with different standard size and pitch size. It will be expected to be promoted in the whole industry to speed up the development of Mini-LED industry.

主要技術(shù)參數(shù)：

代表性Mini-LED顯示模組主要參數(shù)如下：

點(diǎn)間距： < P0.9mm ，極限到P0.3mm，與現(xiàn)行LCD像素點(diǎn)一一對(duì)應(yīng)

模組尺寸：2-10英寸

模組厚度：< 300um

亮度：視乎分辨率來(lái)定，與傳統(tǒng)封裝無(wú)差別

生產(chǎn)效率：200K/H

良品率：99.99%

可靠性 :連續(xù)4000小時(shí)點(diǎn)亮無(wú)損

The main parameters of the representative Mini LED display module are as follows:

Point spacing: < p0.9mm, limit to p0.3mm, corresponding to current LCD pixel points one by one

Module size: 2-10 inches

Module thickness: < 300um

Brightness: no difference from traditional packaging

Production efficiency: 200K / h

Yield Rate: 99.99%

Reliability: lighting for 4000 hours continuously without damage

與國(guó)內(nèi)外同類產(chǎn)品或同類技術(shù)的比較情況：

本項(xiàng)目產(chǎn)品是市場(chǎng)上唯一超高分辨率且柔性的Mini-LED背光模組。該終端產(chǎn)品形態(tài)開(kāi)辟了一個(gè)全新的藍(lán)海市場(chǎng)，不會(huì)與現(xiàn)有大型LED廠直接進(jìn)行競(jìng)爭(zhēng)，競(jìng)爭(zhēng)優(yōu)勢(shì)明顯。產(chǎn)品形態(tài)非常新，性能優(yōu)異，成本低，競(jìng)爭(zhēng)力強(qiáng)，市場(chǎng)空間廣闊；另外，我們的技術(shù)壁壘是完全形成了閉環(huán)系統(tǒng)，包括核心新型封裝材料，搭配特制的設(shè)備及捆綁工藝的模式，可以持續(xù)保持產(chǎn)品及市場(chǎng)能夠領(lǐng)先。

（1）市場(chǎng)上所有的封裝技術(shù)不能實(shí)現(xiàn)超高分辨率（超高密度）的封裝，目前技術(shù)極限只有P0.75mm，本項(xiàng)目的技術(shù)可以實(shí)現(xiàn)極致的P0.2-0.3mm左右；

（2）市場(chǎng)上所有的封裝技術(shù)都不能實(shí)現(xiàn)超薄超柔的基板封裝，目前市場(chǎng)上沒(méi)有真正的柔性LED顯示模組或背光模組的存在；

（3）市場(chǎng)上所有的封裝技術(shù)都不能實(shí)現(xiàn)低成本、高密度、無(wú)縫拼接的Mini-LED背光模組。因?yàn)槌Ｒ?jiàn)的PCB基板厚且笨重，點(diǎn)間距縮小的時(shí)候PCB非常貴，無(wú)法實(shí)現(xiàn)低成本、高密度的模組；且玻璃基板的LED背光模組也存在著加工尺寸難的問(wèn)題；而柔性基板卻可以隨意拼接，且厚度非常薄，可降低最終LCD的厚度。

（4）市場(chǎng)上所有的封裝技術(shù)都不能實(shí)現(xiàn)卷對(duì)卷、超高效率的真正巨量封裝，本項(xiàng)目在未來(lái)1-2年內(nèi)可以實(shí)現(xiàn)600-1000K超高的UPH，效率提高，成本可以大幅下降。

因此，本項(xiàng)目產(chǎn)品形態(tài)非常新，性能優(yōu)異，成本低，競(jìng)爭(zhēng)力強(qiáng)，市場(chǎng)空間廣闊；另外，技術(shù)壁壘完全形成了閉環(huán)系統(tǒng)，包括核心新型封裝材料，搭配特制的設(shè)備及捆綁工藝的模式，可以持續(xù)保持產(chǎn)品及市場(chǎng)能夠領(lǐng)先。因此，該技術(shù)值得關(guān)注，提高中國(guó)Mini-LED可制造水平，并有機(jī)會(huì)實(shí)現(xiàn)超高清Mini-LED顯示屏。

This product is the only ultra-high resolution and flexible Mini-LED backlight module in the market. The terminal product form has opened up a new blue ocean market, will not directly compete with the existing large LED factories, with obvious competitive advantages.

(1) All packaging technologies on the market cannot achieve ultra-high resolution (ultra-high density) packaging. At present, the technical limit is only P0.75mm, and the technology of this project can achieve the ultimate P0.2-0.3mm;

(2) At present, there is no real flexible LED display module or backlight module in the market;

(3) All the packaging technologies in the market can not realize the low-cost, high-density, seamless splicing of the Mini-LEDmini LED backlight module. Because the common PCB substrate is thick and bulky, PCB is very expensive when the point spacing is reduced, so it can not achieve low-cost and high-density modules; and the LED backlight module of glass substrate also has the problem of processing size, and the flexible substrate can be spliced at will, and the thickness is very thin, which can reduce the thickness of the final LCD.

(4) All the packaging technologies in the market can not achieve volume to volume, ultra-high efficiency and really huge package. In the next 1-2 years, the project can achieve 600-1000k ultra-high UPH, with improved efficiency and significantly reduced cost.

Therefore, the product form of this project is very new, the performance is excellent, the cost is low, the competitiveness is strong, and the market space is broad; in addition, the technical barrier has complet

經(jīng)濟(jì)評(píng)價(jià)分析：

Mini-LED具有高分辨率、高亮度、省電及反應(yīng)速度快等特點(diǎn)，被視為新一代顯示技術(shù)，吸引蘋(píng)果、三星、LG、索尼等大型企業(yè)布局發(fā)展。2019年稱為Mini-LED顯示元年，該領(lǐng)域有望成為繼LED照明產(chǎn)業(yè)發(fā)展之后能夠迅速崛起的版塊之一，有望帶動(dòng)整個(gè)LED行業(yè)的改變，包括LED芯片、封裝及應(yīng)用全產(chǎn)業(yè)鏈的全面升級(jí)，使整個(gè)LED產(chǎn)業(yè)或?qū)⑦M(jìn)入新一輪發(fā)展周期。

目前Mini-LED的應(yīng)用主要有兩大方向：直接顯示屏市場(chǎng)及背光應(yīng)用市場(chǎng)。據(jù)高工LED預(yù)測(cè)，2018-2022年，Mini-LED市場(chǎng)規(guī)模將從不足10億元增長(zhǎng)至300億元，當(dāng)前利亞德、洲明科技、雷曼光電紛紛推出點(diǎn)間距在P0.6-P0.8mm的樣品，由于良品率低及成本高等原因并未量產(chǎn)，其可制造問(wèn)題限制了行業(yè)的發(fā)展。

相比而言，封裝難度低的Mini-LED背光應(yīng)用則有望率先成為Mini-LED的主戰(zhàn)場(chǎng)。Apple已經(jīng)宣布將在2020年三季度的Pad新產(chǎn)品中使用Mini-LED背光模組，國(guó)產(chǎn)手機(jī)廠商進(jìn)一步跟進(jìn)，隨后會(huì)在大屏LCD中應(yīng)用，例如高清電視機(jī)等。但當(dāng)前Mini-LED背光市場(chǎng)的量產(chǎn)還未成熟，一是無(wú)法實(shí)現(xiàn)更高分辨率的背光，二是良品率低成本太高。

而本項(xiàng)目的實(shí)施可以為Mini-LED背光應(yīng)用提供更輕薄、分辨率更高的柔性背光模組，打開(kāi)全新的市場(chǎng)；在未來(lái)1-2年內(nèi)，還可以實(shí)現(xiàn)大面積可拼接的、點(diǎn)間距在P0.4mm左右的、超高清RGB Mini-LED柔性顯示屏。同時(shí)該項(xiàng)目的實(shí)施，可為低成本高可靠的超高分辨率的Mini-LED巨量封裝提供全新的行業(yè)解決方案，解決現(xiàn)階段封裝廠無(wú)法解決的可制造問(wèn)題，最終可極大推動(dòng)Mini-LED行業(yè)的發(fā)展。

技術(shù)及工藝創(chuàng)新要點(diǎn)：

1. 高精度柔性基板封裝；

2. 超高密度封裝技術(shù)；

3. 快速巨量封裝技術(shù)；

4. 卷對(duì)卷封裝技術(shù)；

5. 材料+設(shè)備+工藝?yán)?，技術(shù)首創(chuàng)

6. 該技術(shù)具有極大的拓展性：可拓展到超高分辨RGB Mini-LED直顯產(chǎn)品；可拓展到任意高密度面陣式芯片的產(chǎn)品，例如紅外傳感器等；可拓展到任意基板類型的產(chǎn)品，例如Al,Si,玻璃，PCB等

1. High precision flexible substrate packaging.

2. Ultra high density packaging technology

3. Fast and huge package technology

4. Roll to roll packaging technology

5. New material, special designed facility, and carefully matched bonding process window, the whole technology loop is the one and only in industry

6. The technology has great expansibility: it can be expanded to ultra-high resolution RGB Mini led direct display products; It can be expanded to any high density planar array chip products, such as infrared sensors; It can be expanded to any substrate type products, such as Al, Si, glass, PCB, etc.

獲獎(jiǎng)、專利情況：

LED芯片及其制備方法 申請(qǐng)?zhí)枺?019111259807

其他專利正在申請(qǐng)中，設(shè)計(jì)材料，設(shè)備及工藝方法

LED chip and its preparation method

Application No.: 2019111259807

Other patents are pending, design materials, equipment and process methods

申報(bào)單位介紹：

深圳遠(yuǎn)芯光路科技有限公司于2019 年9 月成立，公司是市場(chǎng)唯一超高密度&超輕薄的柔性Mini-LED背光模組供應(yīng)商。公司的背光模組以柔性PI材料為基板，搭載0408型號(hào)及以下的倒裝Mini-LED芯片，可實(shí)現(xiàn)點(diǎn)間距在P0.5mm以下及不同標(biāo)準(zhǔn)尺寸的倒裝封裝模組，為業(yè)界首創(chuàng)。公司由朱玲博士發(fā)起，與劉二壯博士天使投資聯(lián)合創(chuàng)，注冊(cè)資金為100萬(wàn)（工商變更中）。

Shenzhen YuanXin optical Technology Company was established in September 2019. It is the only supplier of ultra-high density and ultra light, thin and flexible Mini LED backlight module in the market. The backlight module of the company is based on flexible PI material, equipped with 0408 and below flip chip Mini led, which can match flip package modules with point spacing below p0.5mm and different standard sizes, and it is the first in this industry area. The company was jointly founded by Dr. Zhu Ling and Dr. Liu Erzhuang with a registered capital of 1 million yuan.

朱玲博士是LED芯片設(shè)計(jì)、加工制造、封裝應(yīng)用及可靠性領(lǐng)域?qū)＜遥薪?2年LED行業(yè)研究與開(kāi)發(fā)的工作經(jīng)驗(yàn)。她曾經(jīng)在世界頂級(jí)LED公司CREE研發(fā)部效力5年，曾帶領(lǐng)開(kāi)發(fā)團(tuán)隊(duì)發(fā)布近30款大功率LED封裝產(chǎn)品，引領(lǐng)了全球的技術(shù)方向，多次獲國(guó)內(nèi)外獎(jiǎng)項(xiàng)；其中CXA-HD系列全面突破業(yè)界當(dāng)時(shí)產(chǎn)品性能（分級(jí)光效最高達(dá)到189lm/W），獲2015年中國(guó)“最佳照明芯片/封裝金獎(jiǎng)”和2014年美國(guó)“最佳燈具設(shè)計(jì)獎(jiǎng)”。另外，在香港大學(xué)攻讀博士期間，她師從香港大學(xué)H. W. Choi教授（Micro-LED 領(lǐng)域的先驅(qū)者，Micro-LED的發(fā)明人之一Martin Dawson教授的學(xué)生），在LED及Micro-LED芯片設(shè)計(jì)、制造與應(yīng)用領(lǐng)域積攢了豐富的經(jīng)驗(yàn)，發(fā)表了相關(guān)學(xué)術(shù)期刊論文近40余篇，申請(qǐng)專利近20項(xiàng)，授權(quán)5項(xiàng)。她曾開(kāi)發(fā)了基于微納結(jié)構(gòu)的大功率LED芯片，短波長(zhǎng)的微盤(pán)GaN固體激光器，激光微納加工系統(tǒng)及基于此系統(tǒng)開(kāi)發(fā)的特殊形狀 LED及薄膜LED芯片，超高顯色指數(shù)（100）的可變色LED，高光效的垂直LED芯片等多種新型光電器件，同時(shí)也研究了低成本新型高效綠色無(wú)污染無(wú)鉛量子點(diǎn)和碳量子點(diǎn)發(fā)光材料。此外，她近期還有多項(xiàng)發(fā)明，有望在行業(yè)中應(yīng)用：例如基于全新的基于Mini-LED顯示屏的巨量轉(zhuǎn)移方法，可使固晶流程UPH能至少提高到600k，而目前市面上最好固晶機(jī)的UPH僅為180k。

劉二壯博士為L(zhǎng)ED、半導(dǎo)體行業(yè)專家，運(yùn)營(yíng)專家，現(xiàn)任美國(guó)Lam Research（全球知名半導(dǎo)體設(shè)備公司）集團(tuán)副總裁，中國(guó)區(qū)總經(jīng)理。劉博士擁有西安交大本科，英國(guó)丹迪大學(xué)博士，美國(guó)哈佛大學(xué)博士后，新加坡國(guó)立大學(xué)MBA等學(xué)歷，曾任CREE公司中國(guó)總經(jīng)理、美國(guó)泛林半導(dǎo)體設(shè)備研發(fā)有限公司中國(guó)區(qū)副總經(jīng)理、上海先進(jìn)半導(dǎo)體有限公司運(yùn)營(yíng)總監(jiān)，曾獲2013年“中國(guó)LED行業(yè)十大領(lǐng)軍人物”稱號(hào)。劉博士的行業(yè)地位能為公司來(lái)帶行業(yè)關(guān)注。

除此之外，公司其他核心團(tuán)隊(duì)成員專業(yè)領(lǐng)域涵蓋了LED 芯片、封裝、產(chǎn)品及量產(chǎn)等多個(gè)領(lǐng)域，團(tuán)隊(duì)成員在LED行業(yè)及管理方面均有10+年以上經(jīng)驗(yàn)，有非常強(qiáng)的產(chǎn)業(yè)化背景及工程能力。

最后，公司的成立得到了許多行業(yè)前輩的支持與幫助，其技術(shù)顧問(wèn)團(tuán)隊(duì)包括以下成員：

-香港的H. W. Choi 博士（Micro-LED 領(lǐng)域先驅(qū)者）

-嚴(yán)群博士（千人專家，顯示屏領(lǐng)域?qū)＜?，前長(zhǎng)虹首席科學(xué)家）

-馬昕博士（千人專家，新能源電池領(lǐng)域?qū)＜遥?/p>

-閆春輝博士（千人專家，LED芯片領(lǐng)域?qū)＜遥?/p>

-吳懿平教授、博導(dǎo)（國(guó)內(nèi)電子封裝、制造領(lǐng)域?qū)＜遥?/p>

產(chǎn)品圖片：